⎝⎛欢乐拼三张⎞⎠

case

The traditional manufacturing industry consisting of large quantities of manual labor will lose its previous advantages and face various new problems in the context of Industry 4.0 and technological advancement.

Post-print inspection application

Post-print inspection application

With the in-depth development of higher density, smaller size, and more complex PCB hybrid technology for electronic assembly, it has become history to inspect the printed quality with the naked eye.

Post-placement detection application scheme

Post-placement detection application scheme

Due to the miniaturization of components, it is difficult to repair micro-component defects after soldering, and component defects are basically impossible to repair.

Post-plugin detection scheme

Post-plugin detection scheme

The electronic plug-in manufacturing process has strict requirements on the quality of the product. For the electronic plug-in manufacturing process of up to hundreds or even thousands of kinds per minute, even a 1% higher product qualification rate means huge economic benefits.

Post-wave soldering quality control plan

Post-wave soldering quality control plan

Due to the characteristics of the wave soldering process, defects are most likely to occur in this process, such as pin shorts, false soldering, missing soldering, and brazing.

Application program after reflow furnace

Application program after reflow furnace

For the SMT production process, with the increasing precision of placement components, post-furnace AOI has become an indispensable and important member of the SMT production line

More R & D solutions

More R & D solutions

With the rapid development of PCB products towards ultra-thin, small components, high density, and fine pitch.

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